wafer dicing saw

 

 Specifications    
 x-axis  stroke 180mm 
 cutting speed 1-250mm/s 
 Notch width  blade size + 10μ
 Notch depth  0-5 mm
 y-axis  Stroke  154 mm
 Accuracy  ±0.005mm
 Setting Range  0.001-99.999 mm
 z-axis  Stroke  10mm
 Setting Range  0.001-9.99 mm
 θ-AXIS  Rotation Angle  0360°
 Rotation Angle  0360°
 Mini Index  16.2″
 Angle Accuracy  ≤1′/90°
 Orientation System  Microscope Departing From Visual Field +CCD(optional)
 Spindle Output  500-1000W
 Revolving Speed  3000-40000 rmp
 Pressure Air  0.5MPa LIQUID300L/min
 Cold Water  0.3MPa LIQUID2.5L/min
 Machine Dimension  (L×W×H)820×770×1250
 Work Piece Size  2" 6"